At IFA 2017, Chinese giant, Huawei has announced the latest in-house mobile platform, Kirin 970. The Kirin 970 is an Octa-core SoC that is built on 10nm technology. 2017. The latest chipset is a testament to Huawei’s vision for the future of artificial intelligence(AI) and by combining the power of the cloud with the speed and responsiveness of native AI processing, Huawei is bringing AI experiences to life and changing the way we interact with our devices.
Kirin 970 is powered by an 8-core CPU and a new generation 12-core GPU. Built using a 10nm advanced process, the chipset packs 5.5 billion transistors into an area of only one cm². The new flagship Kirin 970 is Huawei’s first mobile AI computing platform featuring a dedicated Neural Processing Unit (NPU). Compared to a quad-core Cortex-A73 CPU cluster, the Kirin 970’s new heterogeneous computing architecture delivers up to 25x the performance with 50x greater efficiency. The Kirin 970 can perform the same AI computing tasks faster and with far less power. In a benchmark image recognition test, the Kirin 970 processed 2,000 images per minute, which was faster than other chips on the market.
“As we look to the future of smartphones, we’re at the threshold of an exciting new era,” said Richard Yu, CEO of Huawei Consumer Business Group. “Mobile AI = On-Device AI + Cloud AI. Huawei is committed to developing smart devices into intelligent devices by building end-to-end capabilities that support coordinated development of chips, devices, and the cloud. The ultimate goal is to provide a significantly better user experience. The Kirin 970 is the first in a series of new advances that will bring powerful AI features to our devices and take them beyond the competition.”