Realme to bring the first smartphone powered by the Dimensity 810 SoC. The new 810 chip was launched earlier this month, and MediaTek claimed that it redefines mainstream 5G smartphone experiences with flagship-class technology. The chip comes with a 6nm design that raises the bar for 5G smartphone battery life. Also, this is not the first time Realme is using the Dimensity chips for the first time on Realme devices, the Dimensity 800U was on the X7 5G; MediaTek Dimensity 700 with realme 8 5G and MediaTek Dimensity 1200 with realme X7 Max 5G too. 

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Commenting on this Madhav Sheth, Vice President – realme and CEO, realme India and Europe said, “As a 5G Leader and the world’s fastest-growing smartphone brand, we always believe that our users deserve the best and everyone deserves to experience 5G. We have a long-standing association with MediaTek in bringing some industry-first 5G processors for unparalleled performance. We are excited to announce that realme is collaborating with MediaTek to bring in the World’s first Dimensity 810 5G chipset-enabled smartphone. This pushes the boundaries of innovation and re-affirms our commitment to make consumers future-ready. We are eager to provide our fans with incredible features and performance with cutting-edge 5G-enabled smartphones.”


As for what the chip offers, it provides Arm Cortex-A76 CPU speeds up to 2.4GHz, camera features including artistic AI-color in collaboration with ArcSoft, and advanced noise reduction techniques for superb low-light photography. It comes featuring TSMC’s leading 6nm production process, previously only available in flagship-class 5G phones, the MediaTek Dimensity 810 is one of the most power-efficient chips available, giving brands new opportunities to create the slimmest and lightest 5G smartphones ever.

It is also powered by MediaTek HyperEngine 2.0’s Intelligent Resource Management Engine offering enhanced power efficiency for even longer gameplay and supporting 2CC CA covering up to 120MHz of the spectrum, including mixed duplex FDD+TDD connections, MediaTek Dimensity 810 SoC offers higher average speeds and a seamless handover between two 5G connection areas across a coverage layer, where users receive over 30% greater throughput layer coverage than without CA.

Well with that said, do let us know your opinions on this post Realme to bring the first smartphone powered by the Dimensity 810 SoC by dropping a comment down below. 

Madhav is a Tech Enthusiast and a Gamer. He also writes for The Automotive Blog, where he covers Auto related news.


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