MediaTek launches a new 6nm Dimensity 900 SoC with support for 5G. The Dimensity 900 chipset, built on the 6nm high-performance manufacturing node, supports Wi-Fi 6 connectivity, ultra-fast FHD+ 120Hz displays and supports 108MP main camera too.
Commenting on the launch, Dr JC Hsu, Corporate VP and GM of MediaTek’s Wireless Communications Business Unit said, “Dimensity 900 brings a suite of connectivity, display and 4K HDR visual enhancements to mid-tier 5G smartphones and gives brands great design flexibility for their 5G portfolios, the chipset’s support for 5G and Wi-Fi 6 ensures users get the most of out their devices with super-fast and reliable connectivity.”
The Dimensity 900 chipset is integrated with a 5G New Radio (NR) sub-6GHz modem with carrier aggregation and support for bandwidth up to 120MHz. The chipset is equipped with an octa-core CPU consisting of two Arm Cortex-A78 processors with a clock speed of up to 2.4GHz and six Arm Cortex-A55 cores operating at up to 2GHz. The chipset also integrates an Arm Mali-G68 MC4 GPU, along with an independent AI processing unit.
All the new features that this SoC supports are mentioned below, for a better overview-
- MediaTek’s Imagiq 5.0: The chipset integrates an HDR-native image signal processor (ISP) and incorporates a unique hardware-accelerated 4K HDR video recording engine. This supports up to four concurrent cameras and up to 108MP sensors.
- MediaTek’s MiraVision: The chipset packs upgraded video capabilities from a standard dynamic range (SDR) to HDR with real-time enhancements of HDR10+ video playback to improve colour and contrast of content.
- Premium AI-Camera Enhancements: Smartphones powered by the Dimensity 900 will capture every detail with support for up to 108MP cameras with 32M at 30fps and multi-camera options such as 20+20MP. The chipset integrates our AI processing unit with ultra-efficient INT8, INT16 and accurate FP16 capabilities to deliver premium and super precise AI-camera results.
As for when could we see this SoC on the actual phones, the new MediaTek Dimensity 900 will power devices that are expected to be launched in the global market in Q2 2021.
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